WT/2000 Waste Treatment System


Features

  • Reduce Heavy Metal in Plating Waste Stream
  • Automatic Processing Cycle
  • Adjustable Process Parameters to Meet Local/Municipal Regulations
  • Combination pH Precipitation and Ion Exchange
  • Final pH Adjustment for Discharge
  • Sediment tank for processing metal sludge

Specifications

Dimensions

Length       1400mm (54 7/8”)

Width         3700mm (145 5/8”)

Height        2160mm (85”)

pH precipitation 

Sand FiltrationParticle Filtration

Active Carbon Filtration

Ion Exchange Filtration

Final pH adjustment

200 gal. precipitation Tank
Reduces high concentration of most Heavy Metals
Adjustable pH; With bag filter for collection of precipitated
sludgeSaves Ion Exchange Resin and reduces operational
costsD9xH48” tank; 3 ft3
Reduction of fouling impurities
10″, 10um, spun PP filter, 3 cartridges. Reduction of solid particles
10” cartridge and 2 pcs D9xH48” tanks; 1 ft3 Active Carbon Granules ea.
Primary reduction of organics & foulants, but also some Heavy Metal sp.

2 pcs D9xH48” tanks; 1 ft3 ea. of imminodiacetic macroporous resin. Adjustable pH
Efficient reduction of most Heavy Metals to sub ppm concentrations

Adjustable pH 4-12, to comply with local regulations

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Waste Treatment


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DMC4-RPP Series Reverse Pulse Plating Rectifier/Process Controller


Features

– Precise Control of Plating Current Waveform
– EFORM Software Control of RPP Parameters and Plating Cycle
– Multi Stage Process with RPP or DC Current Control
– Total Amp-Hour Target Set Point per Program
– User Friendly GUI
– Process Data Collection and Storage

 


Available Models

DMC4-RPP-5A-12V

DMC4-RPP-10A-12V

(other sizes available on request)

 

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SE/101 One Cell Plating System


Features

  • One Plating Cell
  • High/Flow/Filtration (enhanced filtration yields fewer defects)
  • Increased filtration speeds shim production
  • Microprocessor controlled
  • Remote diagnostics accessible by modem for services and diagnostics
  • Faster production times
  • Repeatability with uniform results
  • Precise control of shim thickness and thickness variation
  • Ergonomically designed
  • Easy process maintenance

Specifications

Dimensions

Length                23 in.
Depth                  32 in.
Height                 74 in.

Construction

Shell Material    Polypropylene
Plumbing            Polypropylene/PVC

Electrical Input

Voltage             208 to 240 VAC
Phase               1 Ph
Freq.                 50/60 Hz.
Max. Current    20 A.

Plating Power Supply

Max. Current    50 Amps
Max. Voltage    12 VDC

Heating

Temperature Control       +/-1 degree F/C
Wattage                           2 kW

Filtration

Pump    3/4 HP
Filter     1- 20″ DOE 0.45 to 5 micron rated

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VLFP/1002 Two Cell Fast Plating System


Features

  • Small footprint
  • Independent pump/filtration for each cell
  • Front access for maintenance
  • Integrated all-in-one design, integrated sump and electronics
  • Switch mode rectifiers
  • Easy operator interface
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VLSS/1000 Silvering Station


Features

– Rugged Operator Friendly Design
– Durable Polypropylene Construction
– 60 rpm Adjustable Rotation Spindle
– Twin nozzle spray gun
– Two supply bottles with tubing
– Chemical Overspill Containment System
– Semi-Enclosed Clean Working Area
– Air Extraction Ready
– Lighted Work Area

Specifications

Dimensions

Length                23 in.
Depth                  36 in.
Height                 78 in.

Construction

Shell Material    Polypropylene
Plumbing           Polypropylene/PVC

Electrical Input
Voltage                110 to 125 VAC
Current                5 A max.

Electrical Input
Voltage                110 to 125 VAC
Phase                  1
Freq.                    50/60 hz.
Current                5 A max.

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VLPP/1000 Pre-Plate


Features

– Rugged Operator Friendly Design
– Durable Polypropylene Construction
– 4 Position Plating With Traversing Cathode
– 4 Titanium Basket/Static Anode
– Low Flow Solution Circulation
– Low Current Plating For High Surface Quality
– Programmable Control System
– Precision Temperature Control
– Integrated Solution Filtration
– Semi-Enclosed Clean Working Area
– Air Extraction Ready
– Lighted Work Area

Specifications

Dimensions

Length                87 in.
Depth                  36 in.
Height                 78 in.

Construction

Shell Material    Polypropylene
Plumbing           Polypropylene/PVC

Electrical Input

Voltage             208 to 240 VAC
Phase               1 Ph
Freq.                 50/60 Hz.
Max. Current    20 A.

Plating Power Supply

Max. Current    2 x 50 Amps (50 amps per side)
Max. Voltage    10 VDC (per side)

Heating System

Temperature Control       +/-1 degree F/C
Wattage                           6 kW

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VLPB/1000 Process Bench


Features

– Rugged Operator Friendly Design
– Built Using Durable PP Plastic
– Sink With 60 rpm Rotation Table
– Foot Activated Rinsing
– Three Position Rocker Platform
– Continuous Agitation Of Chemical Bowls
– Semi-Enclosed Clean Working Area
– Air Extraction ready
– Lighted Work Area

Specifications

Dimensions

Length                87 in.
Depth                  36 in.
Height                 78 in.

Construction

Shell Material    Polypropylene
Plumbing           Polypropylene/PVC

Electrical Input
Voltage                110 to 125 VAC
Phase                 1 Ph
Freq.                   50/60 Hz.
Current                15 A max.

Process Stations

Rocking Process Trays                3
Sink w/Foot Actuated Dispense   1

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RDP/1000 Rotary Drum Plating


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Drum Plating


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DMC4-PLT-RM1 Remote Control


Features
– Precision Current or Voltage Mode Regulation
– Multi Stage Programmable Ramping
– Precise Amp-Minute Control
– Amp-Minute Totalizer
– Environmentally Sealed Enclosure
– High Impact Plastic Molded Case
– Network Interface, Supervisory Control
– Remote RS485 Operation for Long Distances
– User Defined Alarm Relay Output

Options
– Temperature Control (RTD Input, Dry Contact Output)
– pH Control (2 x Dosing Outputs)
– Additional Relay Control Outputs

Specifications
Input Power                                  24 VDC
Analog Interface                           0-5VDC, 0-10 VDC, 4-20 ma
Digital Interface                            1-RS-485, 1-RS-232, 1-LAN
Relay Outputs                              6
No Of User Programs                  10
No of Stages                                9
Ramp Time Resolution                1 sec.
Amp-Minute Resolution               0.001 Amp-Min.
Dimensions                                  9.180 x 5.250 x 2.363 in.

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Vinyl Record Plating


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SE/1003-1.35 2-Cell Flat Panel


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SE/1003 2-Cell Flat Panel


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SE/1002 2-Cell Flat Panel


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SE/101 Flat Panel


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SA/3b 3-Cell Rotational Plating


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SA/4b 4-Cell Rotational Plating


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Plating Rectifiers/Process Controllers


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Accessories


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SE/2003 2-Cell Flat Panel


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Flat Panel Plating


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Software


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Small Plating Systems


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SA/5b 5-Cell Rotational Plating


5-Cell Rotational Electroplating System
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Rotational Plating


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EFORM Software


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Anode Cleaner AC/1002


Automatic Cleaning and Activating of Plating Anodes

Features

  • Clean and Activate Plating Anodes
  • Separate Sludge and Waste Particles
  • Automatic Cleaning Cycle
  • Process 50 kg per load

Specifications

Working Capacity      3.0 Cu. Ft.

Maximum Load          330 lbs

Motor Power               1.1 kW, 1.5 HP

Weight                          1050 lbs

Overall Dimensions    L-47″ x W- 47″ x H-35″

 

 

 

 

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SA/1b 1-Cell Rotational Plating


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EC/1000 Electroclean System


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DMC4-PLT Series Plating Rectifier/Process Controller


Features

– Precise Current Regulation
– Amp-Hrs Accumulator
– Programmable Multi-Stage Ramping Voltage/Current Profile
– Robust for Plating Environment
– Network Management Interface
– Optional Temperature and pH Control/Monitor
– Efficient Switch Mode Technology
– Computer Network Interface

 


Available Models

DMC4-PLT-8A-6V

DMC4-PLT-25A-12V

DMC4-PLT-50A-12V

DMC4-PLT-100A-12V

DMC4-PLT-250A-12V

(other sizes available on request)

 

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PMT-16 Precious Metal Plating System


 

Features

  • One Plating Cell
  • High/Flow/Filtration (enhanced filtration yields fewer defects)
  • Increased filtration speeds shim production
  • Microprocessor controlled
  • Repeatability for uniform results
  • Precise control of plating thickness and thickness variation
  • Ergonomically designed
  • Easy process maintenance

Specifications

Substrates                            up to 200 mm round wafers, up to 200 mm height square or rectangular
Dimensions                          580 x 815 x 1230 mm (W x D x H)
Total Solution Volume       6 to 20 liters (depending on configuration)
Heating                                  0.5 kW
Temperature Control          +/- 1 deg. C.
Pump                                     1/6 HP
Filtration                               1 x 10″ DOE 0.45 to 5 micron rated
Input Power                         200-230 VAC, 1 Phase or 100 to 130 VAC, 1 Phase
Plating Current                   25 Amps Max. , Specify Range, RPP Optional
Exhaust                                 3-1/2 inch OD Pipe Connection



PMT-16-Dimension-Drawing-(Front-Side-View)

 

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