PMT-16 Precious Metal Plating System


 

Features

  • One Plating Cell
  • High/Flow/Filtration (enhanced filtration yields fewer defects)
  • Increased filtration speeds shim production
  • Microprocessor controlled
  • Repeatability for uniform results
  • Precise control of plating thickness and thickness variation
  • Ergonomically designed
  • Easy process maintenance

Specifications

Substrates                            up to 200 mm round wafers, up to 200 mm height square or rectangular
Dimensions                          580 x 815 x 1230 mm (W x D x H)
Total Solution Volume       6 to 20 liters (depending on configuration)
Heating                                  0.5 kW
Temperature Control          +/- 1 deg. C.
Pump                                     1/6 HP
Filtration                               1 x 10″ DOE 0.45 to 5 micron rated
Input Power                         200-230 VAC, 1 Phase or 100 to 130 VAC, 1 Phase
Plating Current                   25 Amps Max. , Specify Range, RPP Optional
Exhaust                                 3-1/2 inch OD Pipe Connection



PMT-16-Dimension-Drawing-(Front-Side-View)

 

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